Electronics and Communications in Japan (Part II Electronics) · 2005 · 21 citations · 7 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsOptoelectronicsSemiconductor DevicesChip PackagingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationMixed-signal Integration3D Integrated CircuitsAdvanced PackagingProcess Technology SelectionThree-dimensional IntegrationVery-large-scale Integration (Vlsi) Design
The national project of ultrahigh-density electronics SI (system integration) technology was started in 1999 and finalized in March 2004. Many research achievements occurred in various areas, such as three-dimensional integration, optoelectronic composite integration, and optimal connection structure design. Among these, the development of the three-dimensional LSI chip stacking technique is especially important in providing a core for future SiP technology. There are also many intensive studies on this topic in research institutions in various countries. The achievements of research in ASET cover a wide range, from the development of process technology to devices approaching practical models, indicating that the technology is highly mature. © 2005 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 88(10): 37–49, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.20149
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Three dimensional metallization for vertically integrated circuits
Peter Ramm, D. Bollmann, Rosi Braun et al. · Microelectronic Engineering · 1997 · 91 citations
Process integration of 3D chip stack with vertical interconnection
Kenji Takahashi, Yuichi Taguchi, M. Tomisaka et al. · 2004 · 84 citations
Engineering, Electrical Engineering, Materials Engineering +17