Y. Nemoto

Process integration of 3D chip stack with vertical interconnection

Kenji Takahashi, Yuichi Taguchi, M. Tomisaka et al. · 2004 · 84 citations

Engineering, Mechanical Engineering, Computer Architecture +19

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Materials Science, 3D Ic Architecture, Engineering +7

High-performance vertical interconnection for high-density 3D chip stacking package

M. Umemoto, Kazumasa Tanida, Y. Nemoto et al. · 2004 · 74 citations

Engineering, Computer Architecture, Eye Diagram +17

Ultra-high-density 3D chip stacking technology

Kazumasa Tanida, M. Umemoto, Y. Tomita et al. · 2004 · 42 citations

Cu Bump Bonding, Engineering, Mechanical Engineering +21

Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi, S. Segawa, Eun-Sil Jung et al. · Japanese Journal of Applied Physics · 2004 · 29 citations

Ghz 3D, Optical Materials, Engineering +22