Concepedia

Y. Nemoto

YN

Statistics

Publications

8

Citations

370

H-Index

8

Active since

2002

Affiliations

Association of Super-Advanced Electronics(Current)

Y. Nemoto is an author at Association of Super-Advanced Electronics specializing in engineering, interconnect technology, and chip packaging.

Publications per year

2002–2005

8

Publications

8

Process integration of 3D chip stack with vertical interconnection

Kenji Takahashi, Yuichi Taguchi, M. Tomisaka et al. · 2004 · 84 citations

Engineering, Electrical Engineering, Materials Engineering +17

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Engineering, Electrical Engineering, Materials Science +14

High-performance vertical interconnection for high-density 3D chip stacking package

M. Umemoto, Kazumasa Tanida, Y. Nemoto et al. · 2004 · 74 citations

Engineering, Computer Engineering, Electrical Engineering +17

Ultra-high-density 3D chip stacking technology

Kazumasa Tanida, M. Umemoto, Y. Tomita et al. · 2004 · 43 citations

Engineering, Electrical Engineering, Materials Science +15

Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi, S. Segawa, Eun-Sil Jung et al. · Japanese Journal of Applied Physics · 2004 · 29 citations

Engineering, Electrical Engineering, Materials Engineering +17

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