M. Tago

Statistics

Publications

Citations

222

H-Index

Active since

2002

Affiliations

Association of Super-Advanced Electronics(Current)

M. Tago is an author at Association of Super-Advanced Electronics specializing in materials science, interconnect technology, and electronic materials.

Publications per year

2002–2004

Publications

Ultra-high-density interconnection technology of three-dimensional packaging

Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka et al. · Microelectronics Reliability · 2003 · 80 citations

Engineering, Electrical Engineering, Materials Science +14

Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro TOMITA et al. · Japanese Journal of Applied Physics · 2003 · 61 citations

Engineering, Materials Engineering, Materials Science +15

Ultra-high-density 3D chip stacking technology

Kazumasa Tanida, M. Umemoto, Y. Tomita et al. · 2004 · 43 citations

Engineering, Electrical Engineering, Materials Science +15

Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation

Y. Tomita, Tadahiro Morifuji, Tatsuya Ando et al. · 2002 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Copper bump bonding with electroless metal cap on 3 dimensional stacked structure

Y. Tomita, M. Tago, Y. Nemoto et al. · 2002 · 15 citations

Engineering, Electrical Engineering, Materials Science +15

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