Yanhong Tian

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 244 citations

Natural Sciences, Materials Engineering, Materials Science +13

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices

Su Ding, Jinting Jiu, Yue Gao et al. · ACS Applied Materials & Interfaces · 2016 · 172 citations

Natural Sciences, Materials Engineering, Materials Science +17

Flexible Electronic Systems via Electrohydrodynamic Jet Printing: A MnSe@rGO Cathode for Aqueous Zinc-Ion Batteries

Shang Wang, Guifang Zeng, Qing Sun et al. · ACS Nano · 2023 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +17

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Materials Science and Engineering A · 2017 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +17

Recent progress in polyaniline-based chemiresistive flexible gas sensors: design, nanostructures, and composite materials

Jiayue Wen, Shang Wang, Jiayun Feng et al. · Journal of Materials Chemistry A · 2024 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +17