Yanhong Tian

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 239 citations

Materials Engineering, Materials Science, Growth Behavior +12

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices

Su Ding, Jinting Jiu, Yue Gao et al. · ACS Applied Materials & Interfaces · 2016 · 169 citations

Smart Textile, Engineering, Stretchable Cunw Conductors +22

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Materials Science and Engineering A · 2017 · 112 citations

Materials Science, Materials Engineering, Growth Behavior +12

Flexible Electronic Systems via Electrohydrodynamic Jet Printing: A MnSe@rGO Cathode for Aqueous Zinc-Ion Batteries

Shang Wang, Guifang Zeng, Qing Sun et al. · ACS Nano · 2023 · 104 citations

The Mechanisms of Resistance Spot Welding of Magnesium to Steel

Lin Liu, L. Xiao, Jiayun Feng et al. · Metallurgical and Materials Transactions A · 2010 · 97 citations

Materials Science, Friction Welding, Engineering +6