M. Mayer

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 239 citations

Materials Engineering, Materials Science, Growth Behavior +12

Influence of superimposed ultrasound on deformability of Cu

Hao Huang, A. Pequegnat, Baohua Chang et al. · Journal of Applied Physics · 2009 · 96 citations

Medical Ultrasound, Residual Softening Effect, Engineering +18

Effects of superimposed ultrasound on deformation of gold

I. Lum, Hao Huang, Baohua Chang et al. · Journal of Applied Physics · 2009 · 81 citations

Biomedical Acoustics, Medical Ultrasound, Engineering +18

Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate

I. Lum, M. Mayer, Y. Zhou · Journal of Electronic Materials · 2006 · 70 citations

Materials Science, Materials Engineering, Engineering +7

In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding

A. Shah, M. Mayer, Y. Zhou et al. · Microelectronic Engineering · 2008 · 56 citations

Materials Science, Engineering, Applied Physics +5