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Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

Materials EngineeringMaterials ScienceGrowth BehaviorEngineeringSevere Plastic DeformationCorrosionApplied PhysicsMetallurgical InteractionCu/al Intermetallic CompoundsCopper Ball BondsMicrostructure-strength RelationshipMetallurgical SystemThermomechanical ProcessingMechanics Of MaterialsMicrostructure