C.J. Hang

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 244 citations

Natural Sciences, Materials Engineering, Materials Science +13

Microstructural study of copper free air balls in thermosonic wire bonding

C.J. Hang, Chunqing Wang, Yanhong Tian et al. · Microelectronic Engineering · 2008 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force

C.J. Hang, W.H. Song, I. Lum et al. · Microelectronic Engineering · 2009 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +10

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

Yali Tian, C.J. Hang, Chunqing Wang et al. · Microelectronics Reliability · 2010 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding

A. Pequegnat, C.J. Hang, M. Mayer et al. · Journal of Materials Science Materials in Electronics · 2009 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +13