Concepedia

C.J. Hang

CH

8

Publications

434

Citations

8

H-Index

2007

Active since

Affiliations

University of Waterloo(Current)

Harbin Institute of Technology

C.J. Hang is an author at University of Waterloo specializing in materials science, engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringMechanical EngineeringMechanics Of MaterialsMicrostructureApplied PhysicsCorrosionUltrasound

Publications per year

2007–2024

8

Publications

8

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 239 citations

Materials Engineering, Materials Science, Growth Behavior +12

Microstructural study of copper free air balls in thermosonic wire bonding

C.J. Hang, Chunqing Wang, Yanhong Tian et al. · Microelectronic Engineering · 2008 · 40 citations

Materials Science, Engineering, Microstructural Study +10

Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force

C.J. Hang, W.H. Song, I. Lum et al. · Microelectronic Engineering · 2009 · 37 citations

Materials Science, Materials Engineering, Free-air Ball Deformability +7

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

Yali Tian, C.J. Hang, Chunqing Wang et al. · Microelectronics Reliability · 2010 · 36 citations

Materials Science, Materials Engineering, Engineering +4

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding

A. Pequegnat, C.J. Hang, M. Mayer et al. · Journal of Materials Science Materials in Electronics · 2009 · 27 citations

Materials Engineering, Materials Science, Engineering +12

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