C.J. Hang - Concepedia

Author

C.J. Hang

University of Waterloo

Also Known As

C. J. Hang, C.J. Hang, Chengyu Huang, Chen‐Chen Hang

Publications

441

Citations

H-Index

Concepts

All Affiliations

University of Waterloo Harbin Institute of Technology

About

C.J. Hang is an author at University of Waterloo specializing in materials science, engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	422
2	Materials Science	7	7	422
3	Materials Engineering	4	4	339
4	Mechanical Engineering	4	4	116
5	Applied Physics	3	3	306

C.J. Hang

Publications

434

Citations

H-Index

Page 1

	Year	Citations
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging C.J. Hang, Chunqing Wang, M. Mayer, Microelectronics Reliability Materials EngineeringMaterials ScienceGrowth BehaviorEngineeringSevere Plastic Deformation	2007	239
Microstructural study of copper free air balls in thermosonic wire bonding C.J. Hang, Chunqing Wang, Yanhong Tian, Microelectronic Engineering Materials ScienceEngineeringMicrostructural StudyThermal TransportApplied Physics	2008	40
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force C.J. Hang, W.H. Song, I. Lum, Microelectronic Engineering Materials ScienceMaterials EngineeringFree-air Ball DeformabilityEngineeringMechanical Engineering	2009	37
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound Yali Tian, C.J. Hang, Chunqing Wang, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringFailure Analysis	2010	36
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding A. Pequegnat, C.J. Hang, M. Mayer, Journal of Materials Science Materials in Electronics Materials EngineeringMaterials ScienceEngineeringApplied PhysicsMetallurgical Interaction	2009	27
Bonding wire characterization using automatic deformability measurement C.J. Hang, I. Lum, J. Lee, Microelectronic Engineering Materials ScienceWire CharacterizationStructural IntegrityEngineeringDurability Performance	2008	27
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal I. Lum, C.J. Hang, M. Mayer, Journal of Electronic Materials Materials ScienceSitu StudiesEngineeringSevere Plastic DeformationPower Ultrasound	2009	16
Cellulose Nanofiber‐Supported Electrochemical Percolation of Capacitive Nanomaterials with 0D, 1D, and 2D Structures C.J. Hang, Chao Zhang, Qing‐Fang Guan, Advanced Materials	2024	12

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