Publication | Closed Access
Microstructural study of copper free air balls in thermosonic wire bonding
40
Citations
9
References
2008
Year
Materials ScienceEngineeringMicrostructural StudyThermal TransportApplied PhysicsThermosonic Wire BondingThermophysical PropertyThermodynamicsThermal ConductionElectronic PackagingThermal EngineeringThermal ConductivityThermal Property
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