Microstructural study of copper free air balls in thermosonic wire bonding

Influence of grain size on the mechanical behaviour of some high strength materials

A. Lasalmonie, Jean-Loup Strudel · Journal of Materials Science · 1986 · 345 citations

Natural Sciences, Materials Engineering, Materials Science +16

Hall–Petch relationship in nanometer size range

Ming Zhao, J.C. Li, Qing Jiang · Journal of Alloys and Compounds · 2003 · 143 citations

Natural Sciences, Materials Science, Physics +14

Corrosion study at Cu–Al interface in microelectronics packaging

C.W. Tan, A. R. Daud, Mohd Ambar Yarmo · Applied Surface Science · 2002 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +14

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Characterization · 2003 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +14

Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

Yasuo Takahashi, Michinobu Inoue · Journal of Electronic Packaging · 2001 · 65 citations

Engineering, Materials Engineering, Materials Science +17