Microstructural study of copper free air balls in thermosonic wire bonding

Influence of grain size on the mechanical behaviour of some high strength materials

A. Lasalmonie, Jean-Loup Strudel · Journal of Materials Science · 1986 · 339 citations

Materials Science, Engineering, Mechanical Properties +10

Hall–Petch relationship in nanometer size range

Ming Zhao, J.C. Li, Qing Jiang · Journal of Alloys and Compounds · 2003 · 143 citations

Engineering, Nanotechnology, Applied Physics +4

Corrosion study at Cu–Al interface in microelectronics packaging

C.W. Tan, A. R. Daud, Mohd Ambar Yarmo · Applied Surface Science · 2002 · 96 citations

Materials Science, Corrosion Technology, Engineering +4

Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Characterization · 2003 · 87 citations

Materials Engineering, Materials Science, Deformation Substructures +9

Numerical Study of Wire Bonding—Analysis of Interfacial Deformation Between Wire and Pad

Yasuo Takahashi, Michinobu Inoue · Journal of Electronic Packaging · 2001 · 65 citations

Pad Thickness, Engineering, Severe Plastic Deformation +17