Chunjin Hang

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Materials Science and Engineering A · 2017 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +17

Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Journal of Alloys and Compounds · 2018 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +16

Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Journal of Materials Processing Technology · 2019 · 46 citations

Engineering, Materials Engineering, Materials Science +17

Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor

Jiayun Feng, Yanhong Tian, Sumei Wang et al. · Journal of Material Science and Technology · 2021 · 29 citations

Engineering, Materials Engineering, Materials Science +17

A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure

Fengyi WANG, Xinjie WANG, Ziwen Lv et al. · Materials Today Communications · 2022 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +5