Chunjin Hang

Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Materials Science and Engineering A · 2017 · 112 citations

Materials Science, Materials Engineering, Growth Behavior +12

Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Journal of Alloys and Compounds · 2018 · 58 citations

Materials Science, Materials Engineering, Brittle Fracture +12

Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes

Ruyu Tian, Chunjin Hang, Yanhong Tian et al. · Journal of Materials Processing Technology · 2019 · 45 citations

Materials Science, Materials Engineering, Brittle Fracture +11

Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor

Jiayun Feng, Yanhong Tian, Sumei Wang et al. · Journal of Material Science and Technology · 2021 · 28 citations

Materials Science, Femtosecond Laser Irradiation, Flexible Strain Sensor +11

A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure

Fengyi WANG, Xinjie WANG, Ziwen Lv et al. · Materials Today Communications · 2022 · 21 citations

Materials Science, Novel Antioxidant, Chemistry