Concepedia

Hohyung Lee

HL

Statistics

Publications

11

Citations

246

H-Index

10

Active since

2012

Affiliations

Binghamton University(Current)

Analog Devices (United States)

Xilinx (United States)

Hohyung Lee is an author at Binghamton University specializing in engineering, mechanics of materials, and electronic packaging.

ORCID

Top concepts

Publications per year

2012–2022

11

Publications

11

Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Shuai Shao, Yuling Niu, Jing Wang et al. · 2018 · 47 citations

, , +19

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Yeonsung Kim, Dapeng Liu, Hohyung Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 31 citations

, , +22

A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method

Yuling Niu, Jing Wang, Shuai Shao et al. · Microelectronics Reliability · 2018 · 30 citations

, , +12

Design guideline on board-level thermomechanical reliability of 2.5D package

Shuai Shao, Yuling Niu, Jing Wang et al. · Microelectronics Reliability · 2020 · 22 citations

, , +9

Study on the Explosion of the Hydrogen Fuel Tank of Fuel Cell Electric Vehicles in Semi-Enclosed Spaces

Jinouk Park, Yong-Ho Yoo, Ji-Oh Ryu et al. · Energies · 2022 · 22 citations · Full text

, , +18

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