C. H. Hsu

Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling

Μ. Y. Tsai, C. H. Hsu, C.T.O. Wang · IEEE Transactions on Components and Packaging Technologies · 2004 · 108 citations

Engineering, Thermomechanical Behaviors, Mechanical Engineering +20

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

Μ. Y. Tsai, C. H. Hsu, Cheon-Goo Han · Journal of Electronic Packaging · 2004 · 91 citations

Engineering, Mechanical Engineering, Die Attach +18

The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process

Μ. Y. Tsai, C.T. Wang, C. H. Hsu · IEEE Transactions on Components and Packaging Technologies · 2006 · 58 citations

Thermal/residual Deformations, Engineering, Mechanical Engineering +22

Congenital Rickets - A Patient Report

L.-Y. Wang, HT Hung, C. H. Hsu et al. · Journal of Pediatric Endocrinology and Metabolism · 1997 · 12 citations

Renal Pathology, Nephrology, Anatomy +17