IEEE Electron Device Letters · 2000 · 56 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Crystal GrowthSemiconductor Device MaterialsSemiconductor HeterostructuresShort-channel EffectsSilicon MaterialsCrystallizationInterfacial Oxide FormationInterfacial Oxide GrowthInterfacial Oxide LayersSilicon-on-insulator ProcessingSilicon-on-insulator TechnologyThreshold VoltageThreshold Voltage Roll-off
We report the concept and demonstration of a nanoscale ultra-thin-body silicon on-insulator (SOI) P-channel MOSFET with a Si/sub 1-x/Ge/sub x//Si heterostructure channel. First, a novel lateral solid-phase epitaxy process is employed to form an ultra-thin-body that suppresses the short-channel effects. Negligible threshold voltage roll-off is observed down to a channel length of 50 nm. Second, a selective silicon implant that breaks up the interfacial oxide is shown to facilitate unilateral crystallization to form a single crystalline channel. Third, the incorporation of SiGe in the channel resulted in a 70% enhancement in the drive current.
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