2007 · 23 citations · 4 references
Natural SciencesElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDefects In Electronic MaterialsDielectricsHigh-temperature PlasmasMetal-semiconductor ContactsPlasma-surface InteractionsSemiconductor DefectsDevice DegradationGate Oxide DegradationInterface StatesPlasma Exposure EffectsPlasma Exposure TestingPlasma-induced DamagePlasma-induced DegradationPlasma-induced Surface Damage
SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> and HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> > gate dielectrics with TiN electrodes were subjected to an aggressive post-fabrication plasma exposure. A comparison of plate and comb antenna structures before and after exposure demonstrated that the plate antennae structures demonstrate evidence of plasma-induced damage while the comb structures did not. The physical origin of PD in SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> devices was found to be the amphoteric interface states, while the primary effect in HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> devices was charges trapped in the bulk of the high-K film.
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Challenges of high-k gate dielectrics for future MOS devices
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Impact of plasma induced damage on PMOSFETs Tin/HF silicate stack
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