IEEE Transactions on Electron Devices · 2008 · 12 citations · 8 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignCmos Circuit DesignDevice ScalingHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsRadio-frequency Integrated CircuitsCmos ScalingDevice Scaling EffectsMobility EnhancementParasitic CapacitanceParasitic EffectsScaling Effects In CmosStressStress Effects
Effects of parasitic capacitance, external resistance, and local stress on the radio-frequency (RF) performance of the transistors fabricated by 65-nm CMOS technology have been investigated. The effect of parasitic capacitance, particularly C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gb</sub> , becomes significant due to the reduced spacing between the gate and the substrate contact (SC) in proportion to scaling down. Current drivability (I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dsat</sub> ) per unit width has been improved through introduction of mobility enhancement techniques. The influence of external resistance becomes more pronounced for large-dimensional RF transistors due to severe IR drop. Such improved current drivability and large external resistance is responsible for dc performance (g <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</sub> ) degradation and, eventually, cutoff frequency (f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> ) degradation. Local stress effects associated with silicon nitride capping layer and STI stress have been investigated. f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> is largely affected by local stress change, i.e., g <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</sub> degradation at minimal gate poly (GP) pitch and gate-to-active spacing, f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> is dominated by increased parasitic capacitance (C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gb</sub> ) with increasing GP pitch and gate-to-active spacing. Above 10% improvement in f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> has been observed through layout optimization for C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gb</sub> reduction by increasing the transistor active-to-SC spacing.
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Future perspective and scaling down roadmap for RF CMOS
E. Morifuji, H.S. Momose, T. Ohguro et al. · 1999 · 94 citations