2006 · 17 citations · 6 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMechanical Behavior Of MaterialsSemiconductor DevicesChip PackagingDevice ReliabilityIntegrated Circuit DesignInterconnect TechnologyPackaging EngineeringSemiconductor ReliabilityDie AttachElectrical Interconnect ReliabilityInterconnect ReliabilityMechanical ReliabilityPackage ReliabilityPackage-level ReliabilityPackaging-induced ReliabilityThermo-mechanical Stress
The impact of chip-package interaction (CPI) on the mechanical reliability of Cu low-k interconnects was investigated using a 3D multi-level sub-modeling method. The analysis was focused on the die attach process for Pb-free solder where a high thermal load will occur during solder reflow before underfilling to maximize the packaging effect. We compared first the CPI for a CVD-OSG (k=3.0) with MSQ (k=2.7) and spin-on polymer (k=2.7) to investigate how better material properties can improve interconnect reliability. Then the study was extended to porous MSQ (k=2.3) to examine CPI for the 65nm node and beyond. Finally, requirements of the mechanical properties of low-k ILD for improving interconnect reliability are discussed
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