Concepedia

Guotao Wang

GW

Statistics

Publications

5

Citations

197

H-Index

5

Active since

2003

Affiliations

The University of Texas at Austin(Current)

Micron (United States)

Guotao Wang is an author at The University of Texas at Austin specializing in mechanics of materials, engineering, and electronic packaging.

Top concepts

EngineeringMechanics Of MaterialsSolid MechanicsMaterial ScienceMicroelectronicsElectronic PackagingMechanical EngineeringPlasticityApplied PhysicsElectrical Engineering

Publications per year

2003–2006

5

Publications

5

Packaging effects on reliability of cu/low-k interconnects

Guotao Wang, C. Merrill, Jie-Hua Zhao et al. · IEEE Transactions on Device and Materials Reliability · 2003 · 121 citations

Engineering, Packaging Reliability, Mechanical Engineering +17

Thermal stress and debonding in Cu/low k damascene line structures

Yong Du, Guotao Wang, C. Merrill et al. · 2003 · 27 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Guotao Wang, S. Groothuis, Paul S. Ho · 2004 · 21 citations

Engineering, Severe Plastic Deformation, Flip Chip Package +19

Investigation of Residual Stress in Wafer-Level Interconnect Structures Induced by Wafer Processing

Guotao Wang, Dongwen Gan, S. Groothuis et al. · 2006 · 16 citations

Materials Science, Electrical Engineering, Wafer Processing +15

Packaging effect on reliability for Cu/low k structures

Guotao Wang, S. Groothuis, Paul S. Ho · 2004 · 12 citations

Materials Science, Electrical Engineering, Chip-scale Package +14

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