Concepedia

Dongwen Gan

DG

7

Publications

277

Citations

7

H-Index

2002

Active since

Affiliations

The University of Texas at Austin(Current)

Intel (United States)

Dongwen Gan is an author at The University of Texas at Austin specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceThin FilmsElectronic PackagingMaterials EngineeringElectrical EngineeringElectrical InsulationSurface ScienceMicroelectronics

Publications per year

2002–2006

7

Publications

7

Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

Dongwen Gan, Paul S. Ho, Rui Huang et al. · Journal of Applied Physics · 2005 · 72 citations · Full text

Engineering, Mass Transport Measurements, Isothermal Stress Relaxation +20

Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films

Junjun Liu, Dongwen Gan, Chuan Hu et al. · Applied Physics Letters · 2002 · 65 citations

Engineering, Porosity Effect, Physical Property +16

Effect of passivation on stress relaxation in electroplated copper films

Dongwen Gan, Paul S. Ho, Yaoyu Pang et al. · Journal of materials research/Pratt's guide to venture capital sources · 2006 · 47 citations

Materials Science, Materials Engineering, Electromigration Technique +10

Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Rui Huang, Dongwen Gan, Paul S. Ho · Journal of Applied Physics · 2005 · 35 citations

Engineering, Isothermal Stress Relaxation, Grain-boundary Diffusion +16

Effects of dielectric material and linewidth on thermal stresses of Cu line structures

Dongwen Gan, Guotao Wang, Paul S. Ho · 2003 · 21 citations

Engineering, Thermal Conductivity, Interconnect (Integrated Circuits) +17

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