Effect of passivation on stress relaxation in electroplated copper films

Electromigration path in Cu thin-film lines

C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 329 citations

Natural Sciences, Materials Engineering, Materials Science +17

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Thermal strain and stress in copper thin films

Richard P. Vinci, E. M. Zielinski, J. C. Bravman · Thin Solid Films · 1995 · 264 citations

Natural Sciences, Materials Engineering, Materials Science +17

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

R. Keller, Shefford P. Baker, Eduard Arzt · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 259 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reduced electromigration of Cu wires by surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations

Natural Sciences, Electrical Engineering, Materials Engineering +17