Concepedia

Packaging-induced Reliability

Packaging-Induced Reliability is a reliability assessment framework in MEMS that characterizes the degradation mechanisms and performance variability of microelectromechanical systems specifically caused by mechanical, thermal, and environmental stresses introduced during packaging processes.

259

Publications

8.8K

Citations

1.1K

Authors

244

Institutions

Publications per year

2017–2026

25

Parents

Publications

259

Reliability challenges in 3D IC packaging technology

K. N. Tu · Microelectronics Reliability · 2010 · 636 citations

, , +13

Wafer level packaging of MEMS

Masayoshi Esashi · Journal of Micromechanics and Microengineering · 2008 · 353 citations

, , +17

Silicon piezoresistive stress sensors and their application in electronic packaging

Jeffrey C. Suhling, R.C. Jaeger · IEEE Sensors Journal · 2001 · 274 citations

, , +17

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

Peng Zhang, Songbai Xue, Jianhao Wang · Materials & Design · 2020 · 240 citations · Full text

, , +17

Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering

I. Fukuzawa, Susumu Ishiguro, Satoru Nanbu · Reliability physics · 1985 · 202 citations

, , +11

1–5 of 259

Authors

1.1K

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    6 publications · 273 citations

    6

    h-index

  2. MP
    Michael Pecht

    University of Maryland, College Park, United States

    6 publications · 140 citations

    6

    h-index

  3. HG
    Horst Gieser

    Fraunhofer Institute for Reliability and Microintegration, Germany

    5 publications · 69 citations

    5

    h-index

  4. HW
    Heinrich Wolf

    Fraunhofer Institute for Reliability and Microintegration, Germany

    5 publications · 69 citations

    5

    h-index

  5. ID
    Ingrid De Wolf

    IMEC, Belgium

    5 publications · 100 citations

    5

    h-index

1–5 of 1.1K

Institutions

244

  1. Texas Instruments (United States)

    Dallas, United States

    11 h-index

    32 publications

    825 citations

  2. University of Maryland, College Park

    College Park, United States

    11 h-index

    21 publications

    407 citations

  3. Intel (United States)

    Santa Clara, United States

    9 h-index

    30 publications

    1.6K citations

  4. IMEC

    Leuven, Belgium

    8 h-index

    49 publications

    862 citations

  5. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    8 h-index

    24 publications

    476 citations

  6. The University of Texas at Austin

    Austin, United States

    7 h-index

    11 publications

    238 citations

  7. Advanced Semiconductor Engineering (Taiwan)

    Kaohsiung, Taiwan

    6 h-index

    26 publications

    938 citations

  8. GlobalFoundries (United States)

    Santa Clara, United States

    6 h-index

    27 publications

    679 citations

1–8 of 244

Venues

  1. Microelectronics Reliability

    36 publications · 1.7K citations

    20

    h-index

  2. 11

    h-index

  3. 9

    h-index

  4. IEEE Transactions on Advanced Packaging

    7 publications · 197 citations

    7

    h-index

  5. Microelectronic Engineering

    6 publications · 121 citations

    6

    h-index

1–5