Room temperature electroless plating copper seed layer process for damascene interlevel metal structures

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 222 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +15

Damascene copper interconnects with polymer ILDs

D.T. Price, R.J. Gutmann, S. P. Murarka · Thin Solid Films · 1997 · 53 citations

Materials Science, Engineering, Semiconducting Polymer +6

High aspect ratio quarter-micron electroless copper integrated technology

Yosi Shacham‐Diamand, Sergey Lopatin · Microelectronic Engineering · 1997 · 49 citations · Full text

Electroless copper metallisation of titanium nitride

J.C. Patterson, C. Ni Dheasuna, John Barrett et al. · Applied Surface Science · 1995 · 47 citations

Materials Science, Electrometallurgy, Engineering +4

Electrical properties of Ti/TiN films prepared by chemical vapor deposition and their applications in submicron structures as contact and barrier materials

Jiumei Hu, Mahmoud Ameen, G. J. Leusink et al. · Thin Solid Films · 1997 · 26 citations

Materials Engineering, Materials Science, Electrical Engineering +11