Valery M. Dubin

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 222 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +15

Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration

Valery M. Dubin, Yosi Shacham‐Diamand, Bin Zhao et al. · Journal of The Electrochemical Society · 1997 · 197 citations

Engineering, Electroless Cu Thermodynamics, Chemical Deposition +18

High-frequency electrical properties of individual and bundled carbon nanotubes

John J. Plombon, Kevin O’Brien, Florian Gstrein et al. · Applied Physics Letters · 2007 · 187 citations

Electrical Engineering, Engineering, Carbon-based Material +12

Microstructure and reliability of copper interconnects

Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 185 citations

Engineering, Cvd Cu, Chemical Deposition +17

30 years of electroless plating for semiconductor and polymer micro-systems

Yosi Shacham‐Diamand, Tetsuya Ōsaka, Y. Okinaka et al. · Microelectronic Engineering · 2014 · 173 citations

Materials Science, Electroactive Material, Electrical Engineering +10