Valery M. Dubin

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 224 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +17

Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration

Valery M. Dubin, Yosi Shacham‐Diamand, Bin Zhao et al. · Journal of The Electrochemical Society · 1997 · 197 citations

Natural Sciences, Materials Engineering, Materials Science +17

High-frequency electrical properties of individual and bundled carbon nanotubes

John J. Plombon, Kevin O’Brien, Florian Gstrein et al. · Applied Physics Letters · 2007 · 188 citations

Engineering, Electrical Engineering, Materials Science +17

Microstructure and reliability of copper interconnects

Changsup Ryu, Kee-Won Kwon, Alvin L. S. Loke et al. · IEEE Transactions on Electron Devices · 1999 · 187 citations

Natural Sciences, Electrical Engineering, Materials Science +16

30 years of electroless plating for semiconductor and polymer micro-systems

Yosi Shacham‐Diamand, Tetsuya Ōsaka, Y. Okinaka et al. · Microelectronic Engineering · 2014 · 175 citations

Engineering, Materials Engineering, Materials Science +12