Concepedia

Copper Electroless Plating

Copper Electroless Plating is a chemical deposition process, belonging to the class of electroless plating techniques, that selectively deposits a coherent metallic copper layer onto a substrate through autocatalytic reduction of copper ions in solution without the application of external electrical current.

910

Publications

29.5K

Citations

3K

Authors

680

Institutions

Publications per year

2017–2026

206

Parents

Publications

910

Electroless copper deposition for ULSI

Yosi Shacham‐Diamand, Valery M. Dubin, M. Angyal · Thin Solid Films · 1995 · 224 citations · Full text

, , +17

Electroless deposition of Ni–Cu–P, Ni–W–P and Ni–W–Cu–P alloys

J.N. Balaraju, K.S. Rajam · Surface and Coatings Technology · 2004 · 223 citations

, , +13

Reduced electromigration of Cu wires by surface coating

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations

, , +17

On the mechanism of electroless plating. II. One mechanism for different reductants

J. E. A. M. van den Meerakker · Journal of Applied Electrochemistry · 1981 · 201 citations

, , +13

3D Microfluidic Surface‐Enhanced Raman Spectroscopy (SERS) Chips Fabricated by All‐Femtosecond‐Laser‐Processing for Real‐Time Sensing of Toxic Substances

Shi Bai, Daniela Serien, Anming Hu et al. · Advanced Functional Materials · 2018 · 192 citations

, , +17

1–5 of 910

Authors

3K

  1. ET
    E. T. Kang

    National University of Singapore, Singapore

    17 publications · 760 citations

    14

    h-index

  2. ZW
    Zenglin Wang

    Shaanxi Normal University, China

    18 publications · 503 citations

    14

    h-index

  3. KG
    K. G. Neoh

    National University of Singapore, Singapore

    15 publications · 636 citations

    12

    h-index

  4. YL
    Yinxiang Lu

    Fudan University, China

    11 publications · 358 citations

    11

    h-index

  5. YO
    Y. Okinaka

    Waseda University, Japan

    11 publications · 562 citations

    11

    h-index

1–5 of 3K

Institutions

680

  1. National Tsing Hua University

    Hsinchu, Taiwan

    17 h-index

    81 publications

    2.5K citations

  2. National University of Singapore

    Singapore, Singapore

    16 h-index

    66 publications

    2.7K citations

  3. Hefei University of Technology

    Hefei, China

    15 h-index

    73 publications

    2.2K citations

  4. Georgia Institute of Technology

    Atlanta, United States

    15 h-index

    67 publications

    2.3K citations

  5. Seoul National University

    Seoul, South Korea

    14 h-index

    44 publications

    1.8K citations

  6. Sichuan University

    Chengdu, China

    13 h-index

    41 publications

    1.5K citations

  7. Chinese Academy of Sciences

    Beijing, China

    13 h-index

    35 publications

    832 citations

  8. Shaanxi Normal University

    Xi'an, China

    13 h-index

    56 publications

    1.2K citations

1–8 of 680

Venues

  1. Journal of The Electrochemical Society

    JES · 121 publications · 3.8K citations

    39

    h-index

  2. Applied Surface Science

    50 publications · 2K citations

    29

    h-index

  3. Surface and Coatings Technology

    52 publications · 1.9K citations

    25

    h-index

  4. Journal of Alloys and Compounds

    21 publications · 749 citations

    18

    h-index

  5. Electrochimica Acta

    24 publications · 803 citations

    17

    h-index

1–5