Seed Layer Formation

Seed Layer Formation is a thin-film deposition process, distinguished within atomic layer deposition and interconnect formation, in which a conductive nucleation layer is selectively deposited to enable subsequent electroplating and ensure low-resistance electrical connectivity in nanoscale semiconductor devices.

418

Publications

17.1K

Citations

2.2K

Authors

553

Institutions

Publications per year

2017–2026

97

Authors

2.2K

  1. JJ
    Jae Jeong Kim

    Seoul National University, South Korea

    6 publications · 118 citations

    6

    h-index

  2. SS
    Shoso Shingubara

    Kansai University, Japan

    6 publications · 239 citations

    6

    h-index

  3. KM
    K. Matsumoto

    Central Research Institute of Electric Power Industry, Japan

    5 publications · 158 citations

    5

    h-index

  4. TS
    Takashi Suemasu

    University of Tsukuba, Japan

    4 publications · 98 citations

    4

    h-index

  5. KT
    Kaoru Toko

    University of Tsukuba, Japan

    4 publications · 98 citations

    4

    h-index

1–5 of 2.2K

Venues

  1. Thin Solid Films

    21 publications · 552 citations

    17

    h-index

  2. Journal of The Electrochemical Society

    JES · 22 publications · 510 citations

    15

    h-index

  3. ACS Applied Materials & Interfaces

    14 publications · 688 citations

    14

    h-index

  4. Applied Physics Letters

    16 publications · 613 citations

    13

    h-index

  5. Microelectronic Engineering

    12 publications · 418 citations

    12

    h-index

1–5