Concepedia

Seedless Electroplating

Seedless Electroplating is an electrochemical deposition technique in semiconductor manufacturing that directly deposits conductive material onto a dielectric surface without the need for a conventional metallic seed layer, enabling simplified interconnect formation through catalytic or surface-mediated nucleation mechanisms.

29

Publications

734

Citations

115

Authors

44

Institutions

Publications per year

2017–2026

7

Variants

Direct ElectroplatingDirect Plating

Parents

Publications

29

Electromigration characteristics of copper interconnects

N.W. Cheung, Chenming Hu · IEEE Electron Device Letters · 1993 · 125 citations

, , +17

Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging

Ju-Yong Lee, Sung‐Woo Lee, Seung-Ki Lee et al. · Journal of Micromechanics and Microengineering · 2013 · 79 citations

, , +17

Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Dongsheng Chen, Qinghua Lu, Yan Zhao · Applied Surface Science · 2006 · 63 citations

, , +13

Room temperature electroless plating copper seed layer process for damascene interlevel metal structures

Joseph P. O’Kelly, K. Mongey, Y. Gobil et al. · Microelectronic Engineering · 2000 · 53 citations

, , +12

Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications

Sumit Kumar, Daniel Greenslit, Tonmoy Chakraborty et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2009 · 43 citations

, , +16

1–5 of 29

Authors

115

  1. TC
    Tonmoy Chakraborty

    University at Albany, State University of New York, United States

    2 publications · 59 citations

    2

    h-index

  2. MS
    Marco Stampanoni

    Paul Scherrer Institute, Switzerland

    2 publications · 64 citations

    2

    h-index

  3. MK
    Matias Kagias

    Paul Scherrer Institute, Switzerland

    2 publications · 64 citations

    2

    h-index

  4. ZW
    Zhentian Wang

    Paul Scherrer Institute, Switzerland

    2 publications · 64 citations

    2

    h-index

  5. KJ
    Konstantins Jefimovs

    Paul Scherrer Institute, Switzerland

    2 publications · 64 citations

    2

    h-index

1–5 of 115

Institutions

44

  1. ETH Zurich

    Zurich, Switzerland

    2 h-index

    11 publications

    319 citations

  2. Institute for Biomedical Engineering

    Zurich, Switzerland

    2 h-index

    11 publications

    319 citations

  3. University at Albany, State University of New York

    Albany, United States

    2 h-index

    6 publications

    204 citations

  4. Paul Scherrer Institute

    Villigen, Switzerland

    2 h-index

    14 publications

    426 citations

  5. Wenzhou University

    Wenzhou, China

    1 h-index

    3 publications

    39 citations

  6. Luleå University of Technology

    Luleå, Sweden

    1 h-index

    3 publications

    33 citations

  7. York University

    York, United States

    1 h-index

    2 publications

    32 citations

  8. Materials Processing (United States)

    Irving, United States

    1 h-index

    8 publications

    104 citations

1–8 of 44

Venues

  1. Applied Surface Science

    4 publications · 125 citations

    4

    h-index

  2. Journal of Micromechanics and Microengineering

    JMM · 2 publications · 105 citations

    2

    h-index

  3. 2

    h-index

  4. Materials Chemistry and Physics

    2 publications · 48 citations

    2

    h-index

  5. Microelectronic Engineering

    2 publications · 75 citations

    2

    h-index

1–5