Laser-induced site-selective silver seeding on polyimide for electroless copper plating

Site-Selective Direct Silver Metallization on Surface-Modified Polyimide Layers

Kensuke Akamatsu, Shingo Ikeda, Hidemi Nawafune · Langmuir · 2003 · 124 citations

Natural Sciences, Materials Engineering, Materials Science +17

Surface modification of PMDA-oxydianiline polyimide. Surface structure-adhesion relationship

Kang Wook Lee, Steven P. Kowalczyk, Jane M. Shaw · Macromolecules · 1990 · 106 citations

Natural Sciences, Chemistry, Materials Science +15

Surface Modification-Based Synthesis and Microstructural Tuning of Nanocomposite Layers:  Monodispersed Copper Nanoparticles in Polyimide Resins

Kensuke Akamatsu, Shingo Ikeda, Hidemi Nawafune et al. · Chemistry of Materials · 2003 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +17

A Rutherford Scattering Study of Catalyst Systems for Electroless Cu Plating: II . Sensitization and Activation

Ronald L. Meek · Journal of The Electrochemical Society · 1975 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +17

Surface modification of BPDA-PDA polyimide

Kang Wook Lee, Steven P. Kowalczyk, Jane M. Shaw · Langmuir · 1991 · 70 citations

Engineering, Data Science, Construction Materials +8