Plating
Plating is a surface treatment technique that involves the deposition of a metallic layer onto a substrate to enhance its physical, chemical, or mechanical properties.
3.7K
Publications
161.9K
Citations
12.8K
Authors
2.8K
Institutions
Publications per year
2017–2026
727
Parents
3.7K
1–5 of 3.7K
12.8K
16
h-index
15
h-index
University of Electronic Science and Technology of China, China
12 publications · 362 citations
12
h-index
12
h-index
University of Electronic Science and Technology of China, China
14 publications · 400 citations
12
h-index
1–5 of 12.8K
2.8K

Chinese Academy of Sciences
Beijing, China
27 h-index
187 publications
11.8K citations

Shanghai Jiao Tong University
Shanghai, China
21 h-index
114 publications
4.9K citations
Massachusetts Institute of Technology
Cambridge, United States
21 h-index
73 publications
7.2K citations
Tokyo Institute of Technology
Tokyo, Japan
21 h-index
117 publications
4.2K citations

Centre National de la Recherche Scientifique
Paris, France
18 h-index
75 publications
3.7K citations
Tsinghua University
Beijing, China
18 h-index
85 publications
6.5K citations
IBM (United States)
Armonk, United States
18 h-index
53 publications
3.9K citations

Beijing Institute of Technology
Beijing, China
17 h-index
80 publications
5.4K citations
1–8 of 2.8K
JES · 299 publications · 12.3K citations
54
h-index
84 publications · 3.5K citations
38
h-index
AEM · 55 publications · 4.4K citations
35
h-index
JOT · 57 publications · 3.9K citations
34
h-index
Repository · 102 publications · 4.5K citations
33
h-index
1–5