Plating

Plating is a surface treatment technique that involves the deposition of a metallic layer onto a substrate to enhance its physical, chemical, or mechanical properties.

3.7K

Publications

161.9K

Citations

12.8K

Authors

2.8K

Institutions

Publications per year

2017–2026

727

Authors

12.8K

  1. WD
    Wei‐Ping Dow

    National Chung Hsing University, Taiwan

    19 publications · 1.1K citations

    16

    h-index

  2. HH
    Hideo HONMA

    Kanto Gakuin University, Japan

    19 publications · 548 citations

    15

    h-index

  3. YC
    Yuanming Chen

    University of Electronic Science and Technology of China, China

    12 publications · 362 citations

    12

    h-index

  4. MA
    Masanori Abe

    Tokyo Institute of Technology, Japan

    13 publications · 504 citations

    12

    h-index

  5. WH
    Wei He

    University of Electronic Science and Technology of China, China

    14 publications · 400 citations

    12

    h-index

1–5 of 12.8K

Venues

  1. Journal of The Electrochemical Society

    JES · 299 publications · 12.3K citations

    54

    h-index

  2. Surface and Coatings Technology

    84 publications · 3.5K citations

    38

    h-index

  3. Applied and Environmental Microbiology

    AEM · 55 publications · 4.4K citations

    35

    h-index

  4. Journal of Orthopaedic Trauma

    JOT · 57 publications · 3.9K citations

    34

    h-index

  5. PubMed

    Repository · 102 publications · 4.5K citations

    33

    h-index

1–5