Hideo HONMA - Concepedia

Author

Hideo HONMA

Kanto Gakuin University

Also Known As

H Honma, H. HONMA, H. Honma, Hideo HONMA, Hideo Honma

364

Publications

1.9K

Citations

H-Index

Concepts

All Affiliations

Kanto Gakuin University Graduate School USA Toyota Motor Corporation (Japan)

About

Hideo HONMA is an author at Kanto Gakuin University specializing in engineering, materials science, and chemical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	20	44	1.3K
2	Applied Physics	11	11	242
3	Natural Sciences	1	1	12
4	Biomedical Engineering	1	1	18
5	Biomolecular Engineering	1	1	14

Hideo HONMA

Publications

1.4K

Citations

H-Index

Page 1

	Year	Citations
Via-filling using electroplating for build-up PCBs Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara, Electrochimica Acta Materials ScienceElectrometallurgyEngineeringChip On BoardBuild-up Pcbs	2001	115
Advanced copper electroplating for application of electronics Shuhei Miura, Hideo HONMA Surface and Coatings Technology Materials ScienceElectrometallurgyElectrical EngineeringEngineeringElectrochemistry	2003	111
Electroless Copper Deposition Process Using Glyoxylic Acid as a Reducing Agent Hideo HONMA, Takeshi Kobayashi Journal of The Electrochemical Society Environmental ElectrochemistryElectrometallurgyChemical EngineeringEngineeringCorrosion	1994	90
Gold Plating Using the Disulfiteaurate Complex Hideo HONMA, Yasunaga Kagaya Journal of The Electrochemical Society Materials ScienceMaterials EngineeringChemical EngineeringOptical MaterialsGold Sulfite	1993	62
Plating technology for electronics packaging Hideo HONMA Electrochimica Acta Materials ScienceEngineeringAdvanced Packaging (Semiconductors)MicrofabricationFabrication Technique	2001	57
Electroplating Ni micro-cantilevers for low contact-force IC probing Kenichi Kataoka, Shingo KAWAMURA, Toshihiro Itoh, Sensors and Actuators A Physical Electrical EngineeringEngineeringMicrofabricationApplied PhysicsNano Electro Mechanical System	2002	53
Fabrication of Gold Bumps Using Gold Sulfite Plating Hideo HONMA, Ken HAGIWARA Journal of The Electrochemical Society EngineeringMetal NanoparticlesSurface NanotechnologyChemistryChemical Engineering	1995	52
Fabrication of Nickel Microbump on Aluminum using Electroless Nickel Plating Hirozumi Watanabe, Hideo HONMA Journal of The Electrochemical Society EngineeringMechanical EngineeringNickel MicrobumpsElectrometallurgyChemical Engineering	1997	48
Microbump Formation by Noncyanide Gold Electroplating Hideto WATANABE, Shinjirou Hayashi, Hideo HONMA Journal of The Electrochemical Society Gold MicrobumpsEngineeringElectrode-electrolyte InterfaceMetal NanoparticlesMineral Processing	1999	47
Development of sequential build-up multilayer printed wiring boards in Japan Kiyoshi Takagi, Hideo HONMA, Toshiki Sasabe IEEE Electrical Insulation Magazine Materials ScienceIndustrial DesignElectrical EngineeringWiring BoardsEngineering	2003	36

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