Statistics
Publications
14
Citations
519
H-Index
13
Active since
2000
Affiliations
Kuniaki Mihara is an author at National University of Singapore specializing in architecture, heat transfer, and architectural engineering.
Publications per year
2000–2023
14
14
Via-filling using electroplating for build-up PCBs
Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara et al. · Electrochimica Acta · 2001 · 115 citations
1–5 of 14