Via-filling using electroplating for build-up PCBs - Concepedia

Concepedia

Publication | Closed Access

Via-filling using electroplating for build-up PCBs

115

Citations

1

References

2001

Year

Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara, Hideo HONMA

Electrochimica Acta

Materials ScienceElectrometallurgyEngineeringChip On BoardBuild-up PcbsFabrication TechniqueElectronic Packaging3D PrintingElectrochemistry

References

	Year	Citations

Page 1