Concepedia
Electrochimica Acta · 2001 · 115 citations · 1 references
EngineeringMaterials EngineeringMaterials SciencePackaging DesignSemiconductor DevicesForming ProcessesElectroplated MaterialsElectroplatingVia Formation
1
Influence of Bath Composition to Via-Filling by Copper Electroplating.
Takeshi Kobayashi, Junichi Kawasaki, Kuniaki Mihara et al. · Journal of The Japan Institute of Electronics Packaging · 2000 · 16 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +6