Concepedia

Damascene Process

The "Damascene Process" is a semiconductor fabrication technique that belongs to the class of interconnect formation methods, distinguished by its use of trench and via etching followed by metal deposition and chemical-mechanical polishing to create inlaid conductive patterns within a dielectric layer.

256

Publications

12K

Citations

1.4K

Authors

209

Institutions

Publications per year

2017–2026

33

Parents

Publications

256

Low dielectric constant materials for microelectronics

Karen Maex, Mikhaı̈l R. Baklanov, Denis Shamiryan et al. · Journal of Applied Physics · 2003 · 1.6K citations

, , +17

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

, , +16

The chemistry of additives in damascene copper plating

Philippe M. Vereecken, Robert A. Binstead, Hariklia Deligianni et al. · IBM Journal of Research and Development · 2005 · 450 citations

, , +17

Photonic Damascene process for integrated high-Q microresonator based nonlinear photonics

Martin H. P. Pfeiffer, Arne Kordts, Victor Brasch et al. · Optica · 2016 · 360 citations · Full text

, , +17

Ultra-smooth silicon nitride waveguides based on the Damascene reflow process: fabrication and loss origins

Martin H. P. Pfeiffer, Junqiu Liu, Arslan S. Raja et al. · Optica · 2018 · 243 citations · Full text

, , +17

1–5 of 256

Authors

1.4K

  1. TP
    Thomas P. Moffat

    National Institute of Standards and Technology, United States

    8 publications · 696 citations

    8

    h-index

  2. SC
    Shih-Chieh Chang

    National Tsing Hua University, Taiwan

    6 publications · 138 citations

    6

    h-index

  3. JJ
    Jae Jeong Kim

    Seoul National University, South Korea

    6 publications · 161 citations

    6

    h-index

  4. JS
    Jia‐Min Shieh

    National Institutes of Applied Research, Taiwan

    6 publications · 134 citations

    6

    h-index

  5. MT
    Masanori Tsukamoto

    Kyushu University, Japan

    6 publications · 152 citations

    6

    h-index

1–5 of 1.4K

Institutions

209

  1. IMEC

    Leuven, Belgium

    13 h-index

    155 publications

    7K citations

  2. National Institute of Standards and Technology

    Gaithersburg, United States

    11 h-index

    30 publications

    2.6K citations

  3. Toshiba (Japan)

    Tokyo, Japan

    11 h-index

    72 publications

    2.5K citations

  4. IBM (United States)

    Armonk, United States

    11 h-index

    84 publications

    7.3K citations

  5. Centre National de la Recherche Scientifique

    Paris, France

    10 h-index

    30 publications

    953 citations

  6. Intel (United States)

    Santa Clara, United States

    9 h-index

    27 publications

    464 citations

  7. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    9 h-index

    45 publications

    8.8K citations

  8. National Yang Ming Chiao Tung University

    Hsinchu, Taiwan

    9 h-index

    26 publications

    640 citations

1–8 of 209

Venues

  1. Journal of The Electrochemical Society

    JES · 28 publications · 1.3K citations

    20

    h-index

  2. 18

    h-index

  3. Japanese Journal of Applied Physics

    JJAP · 13 publications · 377 citations

    12

    h-index

  4. IEEE Electron Device Letters

    10 publications · 257 citations

    11

    h-index

  5. 10

    h-index

1–5