Thomas P. Moffat - Concepedia

Author

Thomas P. Moffat

National Institute of Standards and Technology ORCID

Also Known As

Moffat, Thomas, T Moffat, T P Moffat, T. Moffat, T. P. MOFFAT, T. P. Moffat, T.P. Moffat, Thomas Moffat, Thomas P Moffat, Thomas P. Moffat

366

Publications

7.3K

Citations

H-Index

112

Concepts

All Affiliations

National Institute of Standards and Technology Material Measurement Laboratory University of Maryland, College Park National Institute of Standards

About

Thomas P. Moffat is an author at National Institute of Standards and Technology specializing in engineering, materials science, and electrochemistry.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	44	102	6.1K
2	Applied Physics	30	57	2.9K
3	Natural Sciences	13	13	715
4	Medicine	1	1	66
5	Biomedical Engineering	1	1	30

Thomas P. Moffat

127

Publications

Citations

H-Index

Page 1

	Year	Citations
Superconformal Electrodeposition of Copper in 500–90 nm Features Thomas P. Moffat, John E. Bonevich, William Huber, Journal of The Electrochemical Society Materials ScienceElectrical EngineeringCopper Oxide MaterialsChemical EngineeringEngineering	2000	402
Electrodeposition of Copper in the SPS-PEG-Cl Additive System Thomas P. Moffat, Daniel Wheeler, D. Josell Journal of The Electrochemical Society Materials ScienceChemical EngineeringEthylene GlycolEngineeringCorrosion	2004	348
H2 evolution at Si-based metal–insulator–semiconductor photoelectrodes enhanced by inversion channel charge collection and H spillover Daniel V. Esposito, Igor Levin, Thomas P. Moffat, Nature Materials Semiconductor TechnologyElectrical EngineeringEngineeringH2 EvolutionH Spillover	2013	328
Superconformal Electrodeposition of Copper Thomas P. Moffat, Daniel Wheeler, William Huber, Electrochemical and Solid-State Letters Materials ScienceChemical EngineeringCopper Oxide MaterialsEngineeringCorrosion	2001	323
Self-Terminating Growth of Platinum Films by Electrochemical Deposition Yihua Liu, Dinçer Gökcen, Ugo Bertocci, Science Materials ScienceEngineeringElectrode-electrolyte InterfacePlatinum FilmsSurface Electrochemistry	2012	219
Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns Thomas P. Moffat, D. Josell Journal of The Electrochemical Society Positive FeedbackVia FillingEngineeringBottom SurfaceElectrode-electrolyte Interface	2012	198
An Electrochemical and X‐Ray Photoelectron Spectroscopy Study of the Passive State of Chromium Thomas P. Moffat, R. M. Latanision Journal of The Electrochemical Society Materials ScienceInorganic ChemistryPassive ElectrodeDielectric ConstantEngineering	1992	163
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing Thomas P. Moffat, Daniel Wheeler, S.-K. Kim, Electrochimica Acta Materials ScienceEngineeringMicrofabricationSurface ScienceApplied Physics	2007	161
Curvature Enhanced Adsorbate Coverage Model for Electrodeposition Thomas P. Moffat, Daniel Wheeler, S.-K. Kim, Journal of The Electrochemical Society Materials ScienceChemical EngineeringElectrical EngineeringEngineeringSurface Electrochemistry	2006	147
Modeling Superconformal Electrodeposition Using The Level Set Method Daniel Wheeler, D. Josell, Thomas P. Moffat Journal of The Electrochemical Society EngineeringSurfactant CoverageAccelerator CoverageChemical DepositionLevel Set Method	2003	145

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