Joaquin Torres

Room temperature electroless plating copper seed layer process for damascene interlevel metal structures

Joseph P. O’Kelly, K. Mongey, Y. Gobil et al. · Microelectronic Engineering · 2000 · 53 citations

Materials Science, Materials Engineering, Electrical Engineering +4

Continuity and morphology of TaN barriers deposited by Atomic Layer Deposition and comparison with physical vapor deposition

W.F.A. Besling, Marie-Laurence Ignacimouttou, A. Humbert et al. · Microelectronic Engineering · 2004 · 13 citations

Materials Science, Materials Engineering, Engineering +10

A new domain-based payment model for emerging mobile commerce scenarios

Diego Suárez, Joaquin Torres, Mildrey Carbonell et al. · 2007 · 13 citations

Fintech, Internet Security, Engineering +14

Process optimization of copper MOCVD using modeling experimental design

Marie-José Mouche, J.L. Mermet, F. Pires et al. · Applied Surface Science · 1995 · 11 citations

Process Design, Electrical Engineering, Engineering +5