J.L. Mermet

Metal—organic chemical vapor deposition of copper using hydrated copper formate as a new precursor

Marie-José Mouche, J.L. Mermet, M. Romand et al. · Thin Solid Films · 1995 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +12

Ti-diffusion barrier in Cu-based metallization

Flavie Braud, J. Torrès, J. Palleau et al. · Applied Surface Science · 1995 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +14

Copper-based metallization for ULSI circuits

J. Torrès, J.L. Mermet, R. Madar et al. · Microelectronic Engineering · 1996 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +14

Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond

Flavie Braud, J. Torrès, J. Palleeau et al. · Microelectronic Engineering · 1997 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16

Process optimization of copper MOCVD using modeling experimental design

Marie-José Mouche, J.L. Mermet, F. Pires et al. · Applied Surface Science · 1995 · 11 citations

Engineering, Materials Engineering, Materials Science +11