Microelectronic Engineering · 1997 · 17 citations · 5 references
EngineeringElectrical EngineeringMaterials EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesCarrier TransportDevice ScalingIntegrated Circuit DesignInterconnect DesignInterconnect TechnologyMetalsBarrier MaterialsCarrier Tunneling Across InterfacesCopper InterconnectsDiffusion BarriersHigh-density InterconnectsInterconnect Resistance ReductionInterconnect Scaling
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The evolution of interconnection technology at IBM
James G. Ryan, R. M. Geffken, N. R. Poulin et al. · IBM Journal of Research and Development · 1995 · 115 citations
Engineering, Computer Engineering, Electrical Engineering +17
Ti-diffusion barrier in Cu-based metallization
Flavie Braud, J. Torrès, J. Palleau et al. · Applied Surface Science · 1995 · 26 citations
Natural Sciences, Materials Engineering, Materials Science +14