Concepedia

High-density Interconnects

High-Density Interconnects is a miniaturized interconnection technology in chip and microwave packaging that enables significantly increased circuit density and improved signal integrity through fine-pitch, multi-layered, and closely spaced conductive pathways.

437

Publications

17.4K

Citations

2.1K

Authors

339

Institutions

Publications per year

2017–2026

67

Variants

Hdi

Parents

Publications

437

Interconnect scaling-the real limiter to high performance ULSI

M. Bohr · 2002 · 549 citations

, , +17

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

, , +17

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

, , +17

Meniscus-Confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds

Jie Hu, Min‐Feng Yu · Science · 2010 · 350 citations

, , +17

High-performance interconnects: an integration overview

Robert Havemann, J.A. Hutchby · Proceedings of the IEEE · 2001 · 334 citations

, , +17

1–5 of 437

Authors

2.1K

  1. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    24 publications · 552 citations

    16

    h-index

  2. EB
    Eric Beyne

    IMEC, Belgium

    12 publications · 323 citations

    11

    h-index

  3. FL
    Fuhan Liu

    Georgia Institute of Technology, United States

    11 publications · 255 citations

    11

    h-index

  4. VS
    Venky Sundaram

    Georgia Institute of Technology, United States

    8 publications · 221 citations

    8

    h-index

  5. JM
    J.D. Meindl

    Georgia Institute of Technology, United States

    7 publications · 405 citations

    7

    h-index

1–5 of 2.1K

Institutions

339

  1. IBM (United States)

    Armonk, United States

    20 h-index

    204 publications

    15.5K citations

  2. Georgia Institute of Technology

    Atlanta, United States

    20 h-index

    214 publications

    6.6K citations

  3. IMEC

    Leuven, Belgium

    15 h-index

    132 publications

    3.3K citations

  4. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    14 h-index

    89 publications

    7.7K citations

  5. Intel (United States)

    Santa Clara, United States

    13 h-index

    92 publications

    6.8K citations

  6. Motorola (United States)

    Schaumburg, United States

    10 h-index

    20 publications

    420 citations

  7. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    9 h-index

    57 publications

    1.5K citations

  8. STMicroelectronics (France)

    Montrouge, France

    9 h-index

    80 publications

    2.3K citations

1–8 of 339

Venues

  1. 16

    h-index

  2. Microelectronic Engineering

    12 publications · 248 citations

    12

    h-index

  3. 10

    h-index

  4. 10

    h-index

  5. IEEE Transactions on Advanced Packaging

    9 publications · 470 citations

    9

    h-index

1–5