Robert Havemann - Concepedia

Author

Robert Havemann

Also Known As

Havemann, Robert Harvey, R. H. HAVEMANN, R. H. Havemann, R. Havemann, R.H Havemann, R.H. HAVEMANN, R.H. Havemann, ROBERT HAVEMANN, Robert H Havemann, Robert H. Havemann

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)Micro Focus (United States)The University of Texas at Austin Philips (Netherlands)National Institute of Standards and Technology

About

Robert Havemann is an author at Texas Instruments (United States) specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	25	926
2	Applied Physics	12	17	728
3	Chemical Engineering	2	2	39
4	Chemistry	1	1	12
5	Civil Engineering	1	1	24

Robert Havemann

Publications

960

Citations

H-Index

Page 1

	Year	Citations
High-performance interconnects: an integration overview Robert Havemann, J.A. Hutchby Proceedings of the IEEE EngineeringDevice IntegrationComputer ArchitectureInterconnection Network ArchitectureInterconnect (Integrated Circuits)	2001	326
Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects Ennis T. Ogawa, Alexander J. Bierwag, Ki-Don Lee, Applied Physics Letters EngineeringIntegrated CircuitsDual-damascene Cu/oxide InterconnectsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2001	68
Air-gap formation during IMD deposition to lower interconnect capacitance B.P. Shieh, Krishna C. Saraswat, J.P. McVittie, IEEE Electron Device Letters EngineeringMetal LinesChemical DepositionInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	1998	64
Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects E.T. Ogawa, K.-D. Lee, Hideki Matsuhashi, EngineeringInterconnect (Integrated Circuits)Failure BehaviorCurrent DensitiesReliability Engineering	2002	51
Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect Shin-Puu Jeng, Robert Havemann, Mi-Chang Chang MRS Proceedings Process IntegrationElectrical EngineeringPhysical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)	1994	47
An 0.8&amp;#181;m CMOS technology for high performance logic applications R. A. Chapman, R.A. Haken, David A. Bell, Electrical EngineeringEngineeringVlsi DesignHigh-speed ElectronicsDevice Integration	1987	36
An 8 ns BiCMOS 1 Mb ECL SRAM with a configurable memory array size Hoang Vinh Tran, K. Fung, David A. Bell, EngineeringVlsi DesignMemory DesignEmerging Memory TechnologyComputer Architecture	2003	27
Damascene integration of copper and ultra-low-k xerogel for high performance interconnects E. M. Zielinski, Stephen W. Russell, R. S. List, Materials ScienceMaterials EngineeringChemical EngineeringMaterial AnalysisEngineering	2002	27
Overview Of Process Integration Issues For Low K Dielectrics Robert Havemann, Manoj Kumar Jain, R. S. List, MRS Proceedings Process IntegrationElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Time-dependent Dielectric Breakdown	1998	25
Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals Qing-Tang Jiang, Matt Nowell, Brendan Foran, Journal of Electronic Materials Materials ScienceEngineeringDamascene TrenchesCivil EngineeringGeology	2002	24

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