Krishna C. Saraswat

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Computer Engineering, Electrical Engineering +17

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Max M. Shulaker, Gage Hills, Rebecca Park et al. · Nature · 2017 · 843 citations

Engineering, Computer Engineering, Materials Science +16

Nanometre-scale germanium photodetector enhanced by a near-infrared dipole antenna

Liang Tang, Şükrü Ekin Kocabaş, Salman Latif et al. · Nature Photonics · 2008 · 698 citations

Engineering, Electrical Engineering, Materials Science +14

Improved Contacts to MoS₂ Transistors by Ultra-High Vacuum Metal Deposition

Chris English, Gautam Shine, Vincent E. Dorgan et al. · Nano Letters · 2016 · 539 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Interconnect limits on gigascale integration (GSI) in the 21st century

Jeffrey A. Davis, A. E. Kaloyeros, M. Beylansky et al. · Proceedings of the IEEE · 2001 · 514 citations

Engineering, Computer Engineering, Electrical Engineering +17