Shin-Puu Jeng - Concepedia

Author

Shin-Puu Jeng

Taiwan Semiconductor Manufacturing Company (Taiwan)

Also Known As

Glenn, Mike Spil, S. -P. Jeng, S. Jeng, S. P Jeng, S. P. Jeng, S.-P. Jeng, S.P. Jeng, Sheng-Long Jeng, Shin-Puu Jeng

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)Texas Instruments (United States)Yale University University of Florida Taiwan Semiconductor Manufacturing Company (United States)

About

Shin-Puu Jeng is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	29	966
2	Applied Physics	12	14	365
3	Computer Engineering	10	10	513
4	Chemistry	4	4	146
5	Natural Sciences	3	3	136

Shin-Puu Jeng

Publications

1.1K

Citations

H-Index

Page 1

	Year	Citations
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo, EngineeringRadio FrequencyIntegrated CircuitsPower ElectronicsSystem Integration	2012	125
Anomalous diffusion of fluorine in silicon Shin-Puu Jeng, R. Canteri, M. Anderle, Applied Physics Letters Ion ImplantationEngineeringPhysicsNatural SciencesSurface Science	1992	80
Multilayer RDL Interposer for Heterogeneous Device and Module Integration Yi-Hang Lin, M.C. Yew, S.M. Chen, 3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineeringDevice Integration	2019	72
High density 3D integration using CMOS foundry technologies for 28 nm node and beyond Jason Lin, W.C. Chiou, K.F. Yang, EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Chip Integration StructuresHigh Density 3D	2010	70
Reliability evaluation of a CoWoS-enabled 3D IC package Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh, EngineeringMechanical EngineeringComputer ArchitectureIntegrated CircuitsReliability Engineering	2013	64
Preparation Of Low-Density Xerogels At Ambient Pressure For Low K Dielectrics Dianna Smith, Jeffrey C. Anderson, C. C. Cho, MRS Proceedings Materials EngineeringMaterials ScienceLow-density XerogelsEngineeringLow K Dielectrics	1995	56
Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect Shin-Puu Jeng, Robert Havemann, Mi-Chang Chang MRS Proceedings Process IntegrationElectrical EngineeringPhysical Design (Electronics)EngineeringAdvanced Packaging (Semiconductors)	1994	47
Satellite structure in the photoemission spectra of MnO(100) Shin-Puu Jeng, Robert J. Lad, Victor E. Henrich Physical review. B, Condensed matter Transition Metal ChalcogenidesInorganic ChemistrySingle-crystal MnoEngineeringPhotochemistry	1991	43
Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages Po-Yao Lin, M.C. Yew, Shu‐Shen Yeh, EngineeringMechanical EngineeringComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)	2021	40
Surface passivation of Ni/Cr alloy at room temperature Shin-Puu Jeng, Paul H. Holloway, Christopher Batich Surface Science Materials ScienceMaterials EngineeringEngineeringSuperalloyCorrosion	1990	35

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