Shin-Puu Jeng

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 125 citations

Engineering, Radio Frequency, Integrated Circuits +16

Anomalous diffusion of fluorine in silicon

Shin-Puu Jeng, R. Canteri, M. Anderle et al. · Applied Physics Letters · 1992 · 80 citations

Ion Implantation, Engineering, Physics +11

Multilayer RDL Interposer for Heterogeneous Device and Module Integration

Yi-Hang Lin, M.C. Yew, S.M. Chen et al. · 2019 · 72 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

Jason Lin, W.C. Chiou, K.F. Yang et al. · 2010 · 70 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +26

Reliability evaluation of a CoWoS-enabled 3D IC package

Bahareh Banijamali, Chien‐Chia Chiu, Cheng‐Chieh Hsieh et al. · 2013 · 64 citations

Engineering, Mechanical Engineering, Computer Architecture +19