Barrier Materials

Barrier Materials is a class of thin-film materials used in microfabrication to prevent the diffusion of atoms or ions between interconnect layers, distinguished by their high chemical stability and low diffusivity in integrated circuit manufacturing processes.

2.1K

Publications

92.3K

Citations

7.5K

Authors

1.6K

Institutions

Publications per year

2017–2026

449

Authors

7.5K

  1. JK
    Junichi Koike

    Tohoku University, Japan

    15 publications · 798 citations

    13

    h-index

  2. GC
    G. C. Wood

    University of Manchester, United Kingdom

    13 publications · 677 citations

    13

    h-index

  3. JC
    Jaime C. Grunlan

    Texas A&M University, United States

    12 publications · 831 citations

    12

    h-index

  4. GT
    G.E. Thompson

    University of Manchester, United Kingdom

    13 publications · 635 citations

    12

    h-index

  5. EK
    E. Kolawa

    California Institute of Technology, United States

    12 publications · 813 citations

    12

    h-index

1–5 of 7.5K

Venues

  1. Surface and Coatings Technology

    150 publications · 6.3K citations

    44

    h-index

  2. Applied Physics Letters

    84 publications · 6K citations

    38

    h-index

  3. Thin Solid Films

    109 publications · 4.5K citations

    37

    h-index

  4. Journal of Applied Physics

    79 publications · 3.8K citations

    33

    h-index

  5. Journal of The Electrochemical Society

    JES · 67 publications · 2.5K citations

    30

    h-index

1–5