Suppression of 193-nm photoresist deformation by H2 addition to fluorocarbon plasma in via-hole etching

Dry Etch Resistance of Organic Materials

H. Gokan, S. Esho, Y. Ohnishi · Journal of The Electrochemical Society · 1983 · 260 citations

Natural Sciences, Materials Engineering, Materials Science +13

Near‐Surface Damage and Contamination after  CF 4 /  H 2 Reactive Ion Etching of Si

G. S. Oehrlein, R. M. Tromp, J. C. Tsang et al. · Journal of The Electrochemical Society · 1985 · 154 citations

Engineering, Materials Engineering, Materials Science +17

Diagnostics and control of radicals in an inductively coupled etching reactor

H. Sugai, Keiji Nakamura, Yukinobu Hikosaka et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1995 · 121 citations

Natural Sciences, Materials Science, Physics +16

Investigation of ash damage to ultralow-k inorganic materials

Kazumasa Yonekura, Shigenori Sakamori, Kinya Goto et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2004 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +17

Deposition control for reduction of 193nm photoresist degradation in dielectric etching

Naoki Negishi, Hiroki Takesue, Masahiro Sumiya et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2005 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +16