Applied Physics Letters · 1990 · 11 citations · 4 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationMetal-oxide-semiconductor Field-effect TransistorsMos CapacitorsSemiconductor DefectsSemiconductor InterfacesCapacitanceCapacitance-voltage CharacteristicsCapacitance-voltage CharacterizationDeep-level DefectsDefect CentersPolycrystalline SiliconRapid Thermal AnnealingThermal Annealing
Anomalous capacitance-voltage (C-V) characteristics of BF2-implanted p+-polycrystalline silicon (polysilicon) gate metal-oxide-semiconductor (MOS) structures annealed by rapid thermal annealing (RTA) are reported for the first time. It is found that both high-frequency and quasi-static C-V curves exhibit an increased capacitance at the depletion and weak inversion regions, which increases with p+-polysilicon RTA drive-in durations. The quasi-static C-V curves show a gate bias dependence of the inversion capacitance which shows a distorted ‘‘plateau’’ (i.e., reduced inversion capacitance for a very narrow gate voltage range) in the strong inversion regions. These anomalous C-V characteristics are believed to be due to the penetrated B-F complexes which act as interface state and deep level defect centers.
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Submicrometer-channel CMOS for low-temperature operation
J.Y.-C. Sun, Yuan Taur, R.H. Dennard et al. · IEEE Transactions on Electron Devices · 1987 · 127 citations
Engineering, Computer Engineering, Electrical Engineering +17