H.C. Kirsch

Heat Capacity Measurements on Small Samples at Low Temperatures

Rainer Bachmann, F. J. DiSalvo, T. H. Geballe et al. · Review of Scientific Instruments · 1972 · 548 citations

Heat Capacity Measurements, Silicon Chip Bolometer, Engineering +15

Anomalous C-V characteristics of implanted poly MOS structure in n/sup +//p/sup +/ dual-gate CMOS technology

C.-Y. Lu, J.M. Sung, H.C. Kirsch et al. · IEEE Electron Device Letters · 1989 · 85 citations

Materials Engineering, Materials Science, Electrical Engineering +12

Process limitation and device design tradeoffs of self-aligned TiSi/sub 2/ junction formation in submicrometer CMOS devices

C.-Y. Lu, J.J. Sung, R. Liu et al. · IEEE Transactions on Electron Devices · 1991 · 63 citations

Electrical Engineering, Engineering, Vlsi Design +15

Optical properties and superconductivity of NbSe2

Rainer Bachmann, H.C. Kirsch, T. H. Geballe · Solid State Communications · 1971 · 51 citations

Superconducting Material, Optical Materials, Engineering +6

The low temperature heat capacity and electrical resistivity of ReO3

C. N. King, H.C. Kirsch, T. H. Geballe · Solid State Communications · 1971 · 44 citations

Materials Science, Materials Engineering, Electrical Engineering +8