Two-dimensional, electrostatic finite element study of tip–substrate interactions in electric force microscopy of high density interconnect structures

Damascene copper electroplating for chip interconnections

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Resolution and contrast in Kelvin probe force microscopy

Heiko O. Jacobs, P. Leuchtmann, O.J. Homan et al. · Journal of Applied Physics · 1998 · 469 citations

Natural Sciences, Biophysics, Materials Science +17

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Engineering, Materials Engineering, Materials Science +12

Surface potential mapping: A qualitative material contrast in SPM

Heiko O. Jacobs, H. Knapp, S. Müller et al. · Ultramicroscopy · 1997 · 196 citations

Natural Sciences, Materials Science, Surface Science +6

Two-dimensional surface dopant profiling in silicon using scanning Kelvin probe microscopy

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Engineering, Materials Engineering, Materials Science +17