DC Compact Model for SOI Tunnel Field-Effect Transistors

Bharat Bhushan, Kaushik Nayak, V. Ramgopal Rao

IEEE Transactions on Electron Devices · 2012 · 100 citations · 9 references

Concepts

Abstract

A physics-based dc compact model for SOI tunnel field-effect transistors (TFETs) has been developed in this paper utilizing Landauer approach. The important transistor electrical parameters, i.e., threshold voltage <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">V</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> , charge in the channel <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">Q</i> , gate capacitance <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">G</sub> , drain current <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">,</i> subthreshold swing <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S</i> , transconductance <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">m</sub> , and output conductance <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">,</i> have been modeled. The model predicts the low subthreshold swing values (less than 60 mV/dec) observed in TFETs and shows a good match with the technology computer aided design (TCAD) results. Model validation was carried out using TCAD simulation for different TFET structures with abrupt junctions, i.e., 40-nm Si nTFET and pTFET, a 0.4-μm Si nTFET, and a 40-nm Ge nTFET. The compact model predictions are in good agreement with the TCAD simulation results.

References

9