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Impact Ionization MOS (I-MOS)—Part I: Device and Circuit Simulations
307
Citations
16
References
2004
Year
Low-power ElectronicsDevice ModelingElectrical EngineeringImpact Ionization MosEngineeringIon ImplantationCircuit DesignNanoelectronicsBias Temperature InstabilityApplied PhysicsContinued ScalingComputer EngineeringPower Semiconductor DeviceNovel TransistorPower ElectronicsIon EmissionMicroelectronics
One of the fundamental problems in the continued scaling of transistors is the 60 mV/dec room temperature limit in the subthreshold slope. In part I this work, a novel transistor based on the field-effect control of impact-ionization (I-MOS) is explored through detailed device and circuit simulations. The I-MOS uses gated-modulation of the breakdown voltage of a p-i-n diode to switch from the OFF state to the ON state and vice-versa. Device simulations using MEDICI show that the I-MOS has a subthreshold slope of 5 mV/dec or lower and I/sub ON/>1 mA//spl mu/m at 400 K. Simulations were used to further explore the characteristics of the I-MOS including the transients of the turn-on mechanism, the short-channel effect, scalability, and other important device attributes. Circuit mode simulations were also used to explore circuit design using I-MOS devices and the design of an I-MOS inverter. These simulations indicated that the I-MOS has the potential to replace CMOS in high performance and low power digital applications. Part II of this work focuses on I-MOS experimental results with emphasis on hot carrier effects, germanium p-i-n data and breakdown in recessed structure devices.
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