Journal of Electronic Materials · 2008 · 15 citations · 7 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesThermal AnalysisChip PackagingDevice ReliabilityIntegrated Circuit DesignIntegrated Circuit FabricationSemiconductor ReliabilityFlip-chip BumpingFlip-chip PackagingOrganic SubstratesThermal Effects In Integrated CircuitsThermal ReliabilityThermal Reliability AssessmentThermo-mechanical Stress
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Pb-free solders for flip-chip interconnects
D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations
Engineering, Electrical Engineering, Materials Engineering +14