Gi-Jo Jung

Structure and process development of wafer level embedded SiP (System in Package) for mobile applications

Gi-Jo Jung, Byoung-Yool Jeon, Insoo Kang · 2009 · 19 citations

Embedded Sip, Engineering, Process Development +20

Analysis of electromigration for Cu pillar bump in flip chip package

Jae-Hyouk Yoo, Insoo Kang, Gi-Jo Jung et al. · 2010 · 16 citations

Engineering, Flip Chip Package, Bump Metallization +16

A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates

Hwa–Young Son, Gi-Jo Jung, Byung-Jin Park et al. · Journal of Electronic Materials · 2008 · 15 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications

Hwa–Young Son, Gi-Jo Jung, Jun‐Kyu Lee et al. · 2007 · 14 citations

Engineering, Mechanical Engineering, Organic Substrates +22

Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

Hwa–Young Son, Chang-Kyu Chung, Myung-Jin Yim et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 14 citations

Materials Science, Advanced Packaging, Electrical Engineering +14