Concepedia

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor, Wei Keat Loh, Chun Keang Ooi, R. Chan

Microelectronic Engineering · 2013 · 34 citations · 15 references

Concepts

3D Ic ArchitectureChip-scale PackageEngineeringFluid–structure Interaction AnalysisAdvanced Packaging (Semiconductors)Chip On BoardApplied Physics3D IntegrationChip AttachmentIntegrated CircuitsElectronic PackagingPlastic EncapsulationMicroelectronicsIntegrated Circuit Package3D Printing

References

15

Volume of fluid (VOF) method for the dynamics of free boundaries

C.W. Hirt, B.D. Nichols · Journal of Computational Physics · 1981 · 15.2K citations

Numerical Analysis, Free Boundaries, Engineering +8

Numerical Heat Transfer and Fluid Flow

Chia‐Jung Hsu · Nuclear Science and Engineering · 1981 · 15.2K citations

Heat Transfer Process, Engineering, Nuclear Engineering +12

Overview and outlook of through‐silicon via (TSV) and 3D integrations

John H. Lau · Microelectronics International · 2011 · 324 citations

Engineering, Device Integration, Ic Integration Sip +17

Three-Dimensional Modeling of Mold Filling in Microelectronics Encapsulation Process

R. Y. Chang, Wenli Yang, S.-J. Hwang et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Engineering, Mechanical Engineering, Advanced Manufacturing +17

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Chun‐Sean Lau, M.Z. Abdullah, Fakhrozi Che Ani · Soldering and Surface Mount Technology · 2012 · 47 citations

Engineering, Liquid Metal Cooling, Industrial Engineering +17