Chun Keang Ooi

Analysis of encapsulation process in 3D stacked chips with different microbump array

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor et al. · International Communications in Heat and Mass Transfer · 2012 · 34 citations

Materials Science, 3D Ic Architecture, Chip-scale Package +13

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor et al. · Microelectronic Engineering · 2013 · 34 citations

3D Ic Architecture, Chip-scale Package, Engineering +12

Fluid/Structure Interaction Investigation in PBGA Packaging

Dadan Ramdan, M.Z. Abdullah, C. Y. Khor et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 31 citations

Engineering, Encapsulation Process, Fluid Mechanics +21

FSI Simulation of Wire Sweep PBGA Encapsulation Process Considering Rheology Effect

Dadan Ramdan, M.Z. Abdullah, M. Abdul Mujeebu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 21 citations

Engineering, Fluid Mechanics, Mechanical Engineering +22

Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

Ernest E.S. Ong, M.Z. Abdullah, C. Y. Khor et al. · Engineering Applications of Computational Fluid Mechanics · 2013 · 10 citations · Full text

Engineering, Mechanical Engineering, Advanced Manufacturing +16