C. Y. Khor

Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

Srivalli Chellvarajoo, M.Z. Abdullah, C. Y. Khor · Materials & Design · 2015 · 58 citations · Full text

Materials Science, Diamond-like Carbon, Engineering +7

Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding

C. Y. Khor, Zulkifli Mohamad Ariff, Fakhrozi Che Ani et al. · International Communications in Heat and Mass Transfer · 2009 · 56 citations

Materials Science, Rheological Constitutive Equation, Rheological Measurement +13

FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

C. Y. Khor, M.Z. Abdullah, M. Abdul Mujeebu et al. · International Communications in Heat and Mass Transfer · 2009 · 50 citations

Solder Bump Arrangement, Numerical Study, Electrical Engineering +9

CFD modeling of pin shape effects on capillary flow during wave soldering

Mohd Sharizal Abdul Aziz, M.Z. Abdullah, C. Y. Khor et al. · International Journal of Heat and Mass Transfer · 2014 · 50 citations

Engineering, Fluid Mechanics, Mechanical Engineering +8

Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan

M.Z. Abdullah, C. Y. Khor, Abdullah Aziz Saad · International Journal of Heat and Mass Transfer · 2015 · 48 citations

Radiative Heat Transfer, Heat Transfer Process, Engineering +9